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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCNI021023-P46
MCNI021023-P46
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MCNI021025-P37
MCNI021025-P37
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MCNI022024-P44
MCNI022024-P44
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MCNI022024-P45
MCNI022024-P45
View
MCNI022024-P46
MCNI022024-P46
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MCNI022025-P49
MCNI022025-P49
View
MCNI022029-P45
MCNI022029-P45
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MCNI023025-P41
MCNI023025-P41
View
MCNI023025-P46.5
MCNI023025-P46.5
View
MCNI023025-P47
MCNI023025-P47
View
MCNI023025-P51
MCNI023025-P51
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MCNI024025-P37
MCNI024025-P37
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