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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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Who we are
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total 964 results
Compliant part number
Part number
Description
Status
MCNI037043-P50
MCNI037043-P50
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MCNI037043-P52
MCNI037043-P52
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MCNI037045-P36
MCNI037045-P36
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MCNI037045-P42
MCNI037045-P42
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MCNI037045-P44
MCNI037045-P44
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MCNI037045-P48
MCNI037045-P48
View
MCNI037045-P49
MCNI037045-P49
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MCNI038045-P45
MCNI038045-P45
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MCNI039042-P55
MCNI039042-P55
View
MCNI040045-P56
MCNI040045-P56
View
MCNI042044-P37
MCNI042044-P37
View
MCNI042044-P50
MCNI042044-P50
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