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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCNI011013-P40
MCNI011013-P40
View
MCNI011016-P49
MCNI011016-P49
View
MCNI012014-P40
MCNI012014-P40
L-Band Internally Matched GaN Device
View
MCNI012014-P43
MCNI012014-P43
View
MCNI012014-P48
MCNI012014-P48
L-Band Internally Matched GaN Device
View
MCNI012014-P51
MCNI012014-P51
L-Band Internally Matched GaN Device
View
MCNI012014-P51.5
MCNI012014-P51.5
View
MCNI012014-P52
MCNI012014-P52
View
MCNI012014-P53
MCNI012014-P53
L-Band Internally Matched GaN Device
View
MCNI012014-P56
MCNI012014-P56
L-Band Internally Matched GaN Device
View
MCNI012014-P57
MCNI012014-P57
View
MCNI012016-P46
MCNI012016-P46
View
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