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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCNI01420152-P50
MCNI01420152-P50
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MCNI016017-P30
MCNI016017-P30
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MCNI016017-P40
MCNI016017-P40
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MCNI016017-P44
MCNI016017-P44
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MCNI016017-P46
MCNI016017-P46
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MCNI016017-P50
MCNI016017-P50
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MCNI016018-P37
MCNI016018-P37
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MCNI016018-P45
MCNI016018-P45
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MCNI016018-P50
MCNI016018-P50
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MCNI016020-P42L
MCNI016020-P42L
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MCNI016020-P50
MCNI016020-P50
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MCNI016027-P50
MCNI016027-P50
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