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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCCMPA1722-P25-1L
MCCMPA1722-P25-1L
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MCCMPA1722-P22L
MCCMPA1722-P22L
View
MCCMPA1722-P19.5-1L
MCCMPA1722-P19.5-1L
View
MCCMPA1722-P25.5-1L
MCCMPA1722-P25.5-1L
View
MCCMPA1722-P23.5-1L
MCCMPA1722-P23.5-1L
View
MCCMPA175215-P22-1L
MCCMPA175215-P22-1L
View
MCCMPA175215-P25-1L
MCCMPA175215-P25-1L
View
MCCMPA175215-P21.8L
MCCMPA175215-P21.8L
View
MCCMPA175215-P26.5L
MCCMPA175215-P26.5L
View
MCCMPA1820-P25.7-1
MCCMPA1820-P25.7-1
View
MCCMPA1924-P27-1L
MCCMPA1924-P27-1L
View
MCCMPA27531-P22-1L
MCCMPA27531-P22-1L
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