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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCNI069074-P47.8
MCNI069074-P47.8
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MCNI069074-P48
MCNI069074-P48
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MCNI069074-P49
MCNI069074-P49
View
MCNI069074-P51
MCNI069074-P51
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MCNI069075-P49
MCNI069075-P49
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MCNI069076-P40
MCNI069076-P40
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MCNI069076-P47
MCNI069076-P47
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MCNI070074-P47
MCNI070074-P47
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MCNI070074-P55
MCNI070074-P55
View
MCNI070075-P41
MCNI070075-P41
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MCNI070075-P45
MCNI070075-P45
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MCNI070075-P48
MCNI070075-P48
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