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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCNI024025-P47
MCNI024025-P47
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MCNI025027-P46.5
MCNI025027-P46.5
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MCNI026027-P46
MCNI026027-P46
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MCNI026032-P33
MCNI026032-P33
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MCNI027029-P40
MCNI027029-P40
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MCNI027029-P43
MCNI027029-P43
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MCNI027029-P45
MCNI027029-P45
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MCNI027029-P49
MCNI027029-P49
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MCNI027029-P53.5
MCNI027029-P53.5
View
MCNI027029-P55
MCNI027029-P55
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MCNI027029-P57
MCNI027029-P57
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MCNI027029-P58
MCNI027029-P58
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