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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCNI01610162-P49
MCNI01610162-P49
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MCNI01610201-P49
MCNI01610201-P49
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MCNI01660177-P50
MCNI01660177-P50
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MCNI017018-P40
MCNI017018-P40
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MCNI017018-P43
MCNI017018-P43
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MCNI017020-P46
MCNI017020-P46
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MCNI018020-P46.5
MCNI018020-P46.5
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MCNI018022-P45
MCNI018022-P45
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MCNI018022-P50
MCNI018022-P50
View
MCNI018022-P56
MCNI018022-P56
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MCNI019020-P40
MCNI019020-P40
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MCNI019020-P40
MCNI019020-P40
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