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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
About Us
Who we are
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total 964 results
Compliant part number
Part number
Description
Status
MCNI013015-P36
MCNI013015-P36
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MCNI013015-P44
MCNI013015-P44
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MCNI013015-P46
MCNI013015-P46
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MCNI013018-P37
MCNI013018-P37
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MCNI013018-P40
MCNI013018-P40
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MCNI013018-P43
MCNI013018-P43
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MCNI013018-P46
MCNI013018-P46
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MCNI013018-P47
MCNI013018-P47
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MCNI013018-P49
MCNI013018-P49
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MCNI013018-P50
MCNI013018-P50
View
MCNI013018-P51
MCNI013018-P51
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MCNI013018-P53
MCNI013018-P53
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