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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
About Us
Who we are
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total 964 results
Compliant part number
Part number
Description
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MCCMP0A85105-P36
MCCMP0A85105-P36
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MCCMPA09104-P37
MCCMPA09104-P37
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MCCMPA091103-P34
MCCMPA091103-P34
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MCCMPA091103-P35
MCCMPA091103-P35
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MCCMPA08120-P34
MCCMPA08120-P34
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MCCMPA1418-P33
MCCMPA1418-P33
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MCCMPA1418-P35
MCCMPA1418-P35
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MCCMPA1418-P39
MCCMPA1418-P39
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MCCMPA1722-P18.5
MCCMPA1722-P18.5
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MCCMPA1823-P33
MCCMPA1823-P33
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