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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
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GaN on SiC RF Epi Wafer
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCSPT0038P40
MCSPT0038P40
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MCSPT0037P45
MCSPT0037P45
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MCSPT0036P47
MCSPT0036P47
View
MCSPT0034P45
MCSPT0034P45
View
MCSPT0035P45
MCSPT0035P45
View
MCSPT0033P47
MCSPT0033P47
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MCSPT0032P50
MCSPT0032P50
View
MCCMPA10154-P26-1L
MCCMPA10154-P26-1L
View
MCCMPA1315-P25.5-1L
MCCMPA1315-P25.5-1L
View
MCCMPA138145-P24.5-1
MCCMPA138145-P24.5-1
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MCCMPA138145-P23-1
MCCMPA138145-P23-1
View
MCCMPA13515-P26-1L
MCCMPA13515-P26-1L
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