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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
About Us
Who we are
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total 964 results
Compliant part number
Part number
Description
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MCNI029039-P44
MCNI029039-P44
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MCNI029039-P48
MCNI029039-P48
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MCNI029039-P48.5
MCNI029039-P48.5
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MCNI030031-P55
MCNI030031-P55
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MCNI030034-P41
MCNI030034-P41
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MCNI030035-P35
MCNI030035-P35
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MCNI030035-P37
MCNI030035-P37
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MCNI030035-P46
MCNI030035-P46
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MCNI030035-P57
MCNI030035-P57
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MCNI031031-P36
MCNI031031-P36
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MCNI031031-P44
MCNI031031-P44
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MCNI031031-P47
MCNI031031-P47
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