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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
About Us
Who we are
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total 964 results
Compliant part number
Part number
Description
Status
MCCI037042-P39-1
MCCI037042-P39-1
View
MCNI077085-P36
MCNI077085-P36
View
MCCI037042-P39.5-1
MCCI037042-P39.5-1
View
MCNI077085-P37
MCNI077085-P37
View
MCCI037042-P43-1
MCCI037042-P43-1
View
MCNI077085-P39
MCNI077085-P39
View
MCCI037042-P45-1
MCCI037042-P45-1
View
MCNI077085-P40
MCNI077085-P40
C-Band Internally Matched GaN Device
View
MCCI042044-P33-1
MCCI042044-P33-1
View
MCNI077085-P42
MCNI077085-P42
View
MCCI044050-P39-1
MCCI044050-P39-1
View
MCNI077085-P43
MCNI077085-P43
C-Band Internally Matched GaN Device
View
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