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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
About Us
Who we are
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total 964 results
Compliant part number
Part number
Description
Status
MCNI013029-P47
MCNI013029-P47
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MCNI0135017-P46
MCNI0135017-P46
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MCNI01350175-P48
MCNI01350175-P48
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MCNI0135018-P48
MCNI0135018-P48
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MCNI014015-P37
MCNI014015-P37
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MCNI014015-P47
MCNI014015-P47
View
MCNI0140155-P48
MCNI0140155-P48
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MCNI014016-P47
MCNI014016-P47
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MCNI014017-P36
MCNI014017-P36
View
MCNI014017-P46
MCNI014017-P46
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MCNI014017-P46.5
MCNI014017-P46.5
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MCNI014018-P46
MCNI014018-P46
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