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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
Status
MCNI031034-P54
MCNI031034-P54
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MCNI031034-P56
MCNI031034-P56
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MCNI031035-P38
MCNI031035-P38
View
MCNI031035-P48
MCNI031035-P48
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MCNI031035-P53
MCNI031035-P53
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MCNI031035-P58
MCNI031035-P58
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MCNI031036-P50
MCNI031036-P50
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MCNI031038-P39
MCNI031038-P39
View
MCNI031039-P49
MCNI031039-P49
View
MCNI033036-P36
MCNI033036-P36
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MCNI033036-P46.5
MCNI033036-P46.5
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MCNI033037-P38
MCNI033037-P38
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