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Cu&Al Diamond Composite Material
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Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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total 964 results
Compliant part number
Part number
Description
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MCNI033037-P49
MCNI033037-P49
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MCNI033037-P51
MCNI033037-P51
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MCNI033038-P47
MCNI033038-P47
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MCNI034037-P46
MCNI034037-P46
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MCNI034309-P40
MCNI034309-P40
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MCNI034039-P50
MCNI034039-P50
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MCNI035037-P55
MCNI035037-P55
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MCNI035038-P47.5
MCNI035038-P47.5
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MCNI035039-P38
MCNI035039-P38
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MCNI035039-P49
MCNI035039-P49
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MCNI035039-P51
MCNI035039-P51
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MCNI035040-P45-1
MCNI035040-P45-1
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