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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
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GaAs Linear PA (Die)
GaAs Linear PA (Die)
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GaN IMFET
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GaAs Linear PA (Die)
RF Products
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GaN PA (Package)
GaN PA(Die)
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Part Number
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Frequency Range (MHz)
Psat (dBm)
P1dB (dBm)
Gp (dB)
Gain (dB)
PAE (%)
Current (mA)
Supply Voltage (V)
IMD3(dBc)@Pout(dBm)
Size(mm)
Status
MCCMPA175215-P21.8L
MCCMPA175215-P21.8L
17500-21500
21.8
21
22
25
71
5
-22@19.5
2.2 × 1.4
MCCMPA175215-P26.5L
MCCMPA175215-P26.5L
17500-21500
26.5
22.5
24
25
166
5
-22@23.5
2.2 × 1.4
MCCMPA1820-P25.7-1
MCCMPA1820-P25.7-1
18000-20000
26
25.7
23.5
43.5
184
5
2.2 × 1.1
MCCMPA1924-P27-1L
MCCMPA1924-P27-1L
19000-24000
28
27
25
27
45
300
5
-20@20
2.5 × 1.2
MCCMPA27531-P22-1L
MCCMPA27531-P22-1L
27500-31000
22
22
42
110
5
-20@19.5
2.0 × 1.0
n
n
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