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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
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GaAs Drivers ( Package)
GaAs Drivers ( Package)
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GaAs Drivers ( Package)
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Competitive Products
Package
Status
MCCPA046050-P36.5-LG5
MCCPA046050-P36.5-LG5
4600-5000
31
22
120
36.5
n79
5
28
-30
SKY66319
LGA5 ×5
MCCPA0490592-P33-PQ4
MCCPA0490592-P33-PQ4
4900-5925
31
40
210
33
WiFi
5
29
SE5004L
QFN4 ×4
MCCPA051059-P33.5-PQ5
MCCPA051059-P33.5-PQ5
5100-5900
28
40
150
35.5
WiFi
5
28
-30
QFN5 ×5
MCCPA059064-P33-PQ5
MCCPA059064-P33-PQ5
5900-6400
25
30
150
33
WiFi
5
QFN5 ×5
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