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Cu&Al Diamond Composite Material
Product Performance Benchmark
Typical Application for Package Carrier
Typical Application for Module Case
GaN on SiC RF Epi Wafer
The standard RF Epi structure
The InAlGaN barrier RF EPi structure
Cross Reference
Applications
Low-altitude Economy
Design Support
Sample
News
About Us
Who we are
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DC/DC µModule
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High Speed ADC
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MCDCM4615
MCDCM4615
Dual 6A/ Signal 1.5A LDO
4.5-5.5
1.0- 3.3
Step-down
LTM4615
15x15x3.42mm BGA
MCDCM4613
MCDCM4613
Signal 8A
5.0-36
3.3-15
Step-down
LTM4613
15x15x4.92mm BGA
MCDCM4644
MCDCM4644
Quad 4A/ Signal 16A
4.0-14
0.6-5.5
Step-down
LTM4644
15x9x5mm BGA
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